

Epoxy structural adhesive, used for bonding under-chip filling, COB encapsulation, CSP sealing, electronic tags, camera ...


Epoxy structural adhesive, used for bonding under-chip filling, COB encapsulation, CSP sealing, electronic tags, camera modules, and more.
Widely used in major fields such as packaging, wood processing, automotive, electronics, textiles, and aerospace. Ultraviolet curing adhesive is used for the fixation and protection of electronic components, camera modules, and medical devices, featuring fast curing and eco-friendly properties.